Press Conference for 2022 CASPA Spring Symposium

Invitation to Press Conference for 2022 CASPA Spring Symposium
Mega Trends in Semiconductor Ecosystem

Dear Sir/Madam,
Just as we saw this past year, there are a wide variety of challenges and opportunities awaiting the
semiconductor industry in 2022. The global semiconductor chip industry is expected to grow 10% in 2022
to over US$600 billion for the first time ever. However, there are many challenges to its healthy growth.
For example, shortages and supply chain issues to remain front and center for the first half of the year. The
ongoing talent shortage will be made even more severe by the addition of increased semiconductor
manufacturing facilities. On the technology front, we expect the digital transformation within the industry
to continue and accelerate with the help of the ongoing semiconductor competitiveness bill under US
Congress to invest US$52 billion into the Semiconductor Industry.

In response to these opportunities and challenges, CASPA as the world’s largest Chinese American
semiconductor professional association, will organize this year’s CASPA Spring Symposium with the
theme of “Mega Trends in Semiconductor Ecosystem”. In addition to the speeches, a panel session will
also be held to share more visions from the panelists. Spring Symposium is a signature event for CASPA
and well attended by the technical professionals and executives from Bay Area and worldwide. We are very
pleased to invite you to our 2022 Spring Symposium, scheduled on Saturday 3/12 2:30pm to 6:30pm on the
internet via Zoom. It will be a great opportunity to share your vision at the Symposium. We hope your
presentation will enhance your company’s leadership for the revolution happening in our industry.
We also plan to have an online press conference on Wednesday 03/02 at 12pm to 1pm to promote the
Annual Conference and therefore invite you to come and interview the Conference Organizers and the
speakers. Below are the 2022 Spring Symposium speakers and panelists, we will invite them to the press
conference to share their opinions on topics related to the Symposium.

Ted Spears, VP, Microchip

Rob Mains, GM, Chip Alliance Governance

Huming Bu, VP, IBM Xiaoning Qi, GM, Alibaba PTG

Michael Chang, VP, Advantest

Richard Yang, CTO, Shenyang Fortune Precs. Equip. Co., Ltd.

Please let us know if you need more information. We sincerely hope you can accept to the press conference.

Best Regards,

Ian Wang, Head of Symposium

ybwang@caspa.com

Avery Lu, Deputy Head of Symposium

avery.lu@caspa.com

Haohua Zhou, Ph.D. President of CASPA

haohua@caspa.com